POD : a 3D-integrated broad-purpose acceleration layer.

Bibliographic Details
Main Author:	Woo, Dong Hyuk
Other Authors:	Eng, Marsha, Fryman, Joshua B., Knies, Allan D., Lee, Hsien-Hsin S.
Format:	Article
Language:	Spanish
Subjects:	Procesadores Arquitectura de computadoras Redes Bajo poder Chips Artículos de revista

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