Cita APA

Tong, H., Lai, Y., & Wong, C. (2013). Advanced flip chip packaging (1st edition.). New York, Estados Unidos: Springer.

Citación estilo Chicago

Tong, Ho-Ming,, Yi-Shao Lai, y C.P. Wong. Advanced Flip Chip Packaging. 1st edition. New York, Estados Unidos: Springer, 2013.

Cita MLA

Tong, Ho-Ming,, Yi-Shao Lai, y C.P. Wong. Advanced Flip Chip Packaging. 1st edition. New York, Estados Unidos: Springer, 2013.