RF and Microwave Microelectronics Packaging - Kuang, Ken.; Kim, Franklin; Cahill, Sean S.; SpringerLink (Online service) (New York, NY : Springer US : Imprint: Springer, 2010)
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies -- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages -- Polymeric Microelectromechanical Millimeter Wave Systems -- Millimeter-Wave Chip-on-Board Integration and Packaging -- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules -- RF/Microwave Substrate Packaging Roadmap for Portable Devices -- Ceramic Systems in Package for RF and Microwave -- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications -- LTCC Substrates for RF/MW Application -- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging -- High Performance Microelectronics Packaging Heat Sink Materials -- Technology Research on AlN 3D MCM.
Keywords: Electronics; Microelectronics; Microwaves; Optical engineering; Electronic circuits; Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems