Three-Dimensional Integrated Circuit Design : EDA, Design and Microarchitectures - Xie, Yuan.; Cong, Jingsheng Jason; Sapatnekar, Sachin; SpringerLink (Online service) (New York, NY : Springer US : Imprint: Springer, 2010)
3D Process Technology Considerations -- Thermal and Power Delivery Challenges in 3D ICs -- Thermal-Aware 3D Floorplan -- Thermal-Aware 3D Placement -- Thermal Via Insertion and Thermally Aware Routing in 3D ICs -- Three-Dimensional Microprocessor Design -- Three-Dimensional Network-on-Chip Architecture -- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers -- System-Level 3D IC Cost Analysis and Design Exploration.
Keywords: Electronics; Microelectronics; Optical materials; Electronic materials; Materials-Surfaces.; Thin films; Engineering; Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Surfaces and Interfaces, Thin Films; Engineering, general