Cita APA

SpringerLink (Online service), Tan, C. S., Gutmann, R. J., & Reif, L. R. (2008). Wafer Level 3-D ICs Process Technology (1st ed. 2008.). New York, NY: Springer US : Imprint: Springer.

Citación estilo Chicago

SpringerLink (Online service), Chuan Seng Tan, Ronald J. Gutmann, y L. Rafael Reif. Wafer Level 3-D ICs Process Technology. 1st ed. 2008. New York, NY: Springer US : Imprint: Springer, 2008.

Cita MLA

SpringerLink (Online service), Chuan Seng Tan, Ronald J. Gutmann, y L. Rafael Reif. Wafer Level 3-D ICs Process Technology. 1st ed. 2008. New York, NY: Springer US : Imprint: Springer, 2008.