Materials for Advanced Packaging - Lu, Daniel; Wong, C.P.; SpringerLink (Online service) (New York, NY : Springer US : Imprint: Springer, 2009)
3D Integration Technologies - An Overview -- Advanced Bonding/Joining Techniques -- Advanced Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free Soldering -- Thin Die Production -- Advanced Substrates: A Materials and Processing Perspective -- Advanced Print Circuit Board Materials -- Flip-Chip Underfill: Materials, Process and Reliability -- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips -- Electrically Conductive Adhesives (ECAs) -- Die Attach Adhesives and Films -- Thermal Interface Materials -- Embedded Passives -- Nanomaterials and Nanopackaging -- Wafer Level Chip Scale Packaging -- Microelectromechanical Systems and Packaging -- LED and Optical Device Packaging and Materials -- Digital Health and Bio-Medical Packaging.
Keywords: Optical materials; Electronic materials; Metals; Nanotechnology; Electronics; Microelectronics; Optical and Electronic Materials; Metallic Materials; Nanotechnology; Electronics and Microelectronics, Instrumentation