Solder Joint Reliability Prediction for Multiple Environments - Perkins, Andrew E.; Sitaraman, Suresh K.; SpringerLink (Online service) (New York, NY : Springer US : Imprint: Springer, 2009)
Background -- Literature Review -- Unified Finite Element Modeling for Prediction of Solder Joint Fatigue -- Validation of Unified FEM for Thermal Cycling and Power -- Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling -- Validation of Unified FEM and Development of Fatigue-life Equations for Vibration -- Universal Predictive Fatigue Life Equation and the Effect of Design Parameters -- Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages -- Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments -- Solder Joint Reliability Assessment for Desktop and Space Applications.
Keywords: Electronics; Microelectronics; Metals; Optical materials; Electronic materials; Quality control; Reliability; Industrial safety; Electronics and Microelectronics, Instrumentation; Metallic Materials; Optical and Electronic Materials; Quality Control, Reliability, Safety and Risk