Al-Shouq, A. A., Bartha, J. W., Belfiore, G., Budhathoki, P., Cederström, L., Elfadel, I. (. M., & Fettweis, G. (2016). 3D stacked chips: From emerging processes to heterogeneous systems. Switzerland: Springer.
Citación estilo ChicagoAl-Shouq, Ayesha A., Johann W. Bartha, Guido Belfiore, Puskar Budhathoki, Love Cederström, Ibrahim (Abe) M. Elfadel, y Gerhard Fettweis. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Switzerland: Springer, 2016.
Cita MLAAl-Shouq, Ayesha A., et al. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Switzerland: Springer, 2016.
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