Advanced packaging and manufacturing technology based on adhesion engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method.
Citación estilo ChicagoAdvanced Packaging and Manufacturing Technology Based On Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method.
Cita MLAAdvanced Packaging and Manufacturing Technology Based On Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method.
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