Advanced packaging and manufacturing technology based on adhesion engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method.
Chicago Style CitationAdvanced Packaging and Manufacturing Technology Based On Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method.
MLA CitationAdvanced Packaging and Manufacturing Technology Based On Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method.
Warning: These citations may not always be 100% accurate.