APA Citation

(2014). Design-for-test and test optimization techniques for TSV-based 3D stacked ICs.

Chicago Style Citation

Design-for-test and Test Optimization Techniques for TSV-based 3D Stacked ICs. 2014.

MLA Citation

Design-for-test and Test Optimization Techniques for TSV-based 3D Stacked ICs. 2014.

Warning: These citations may not always be 100% accurate.