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1
Multichip modules : systems advantages, major constructions and materials technologies /
by Johnson, R. Wayne 1957-
Published 1991
Book
2
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
by Lau, John H., Lau, John H., Pao, Yi-Hsin
Published 1997
Book
3
Flip chip technologies /
by Lau, John H.
Published 1996
Book
4
Advanced thermal management materials /
by Jiang, Guosheng
Published 2013
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Book
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