Basics of Cutting and Abrasive Processes /

Detalles Bibliográficos
Autores principales: Toenshoff, Hans Kurt. (Autor), Denkena, Berend. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: eBook
Lenguaje:English
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
Edición:1st ed. 2013.
Colección:Lecture Notes in Production Engineering,
Materias:
Tabla de Contenidos:
  • Introduction to the technology of cutting and abrasive processes
  • Chip formation
  • Chip control
  • Forces and powers in cutting and abrasive processes
  • Energy conversion
  • Modeling
  • Wear
  • Cutting materials
  • High Speed Cutting
  • Hard Cutting, Process Design
  • Hard machining quality
  • Broaching
  • Grinding
  • Gear grinding
  • Process chain
  • Surface
  • Cooling lubrication.