APA Citation

Khan, N., & Hassoun, S. (2013). Designing TSVs for 3D Integrated Circuits (1st ed. 2013.). New York, NY: Springer New York : Imprint: Springer.

Chicago Style Citation

Khan, Nauman., and Soha Hassoun. Designing TSVs for 3D Integrated Circuits. 1st ed. 2013. New York, NY: Springer New York : Imprint: Springer, 2013.

MLA Citation

Khan, Nauman., and Soha Hassoun. Designing TSVs for 3D Integrated Circuits. 1st ed. 2013. New York, NY: Springer New York : Imprint: Springer, 2013.

Warning: These citations may not always be 100% accurate.