Design of Adhesive Joints Under Humid Conditions /

Detalles Bibliográficos
Autor Corporativo:	SpringerLink (Online service)
Otros Autores:	da Silva, Lucas F. M. (Editor ), Sato, Chiaki. (Editor )
Formato:	eBook
Lenguaje:	English
Publicado:	Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
Edición:	1st ed. 2013.
Colección:	Advanced Structured Materials, 25
Materias:	Materials—Surfaces. Thin films. Mechanics. Mechanics, Applied. Polymers . Aerospace engineering. Astronautics. Surfaces and Interfaces, Thin Films. Solid Mechanics. Polymer Sciences. Aerospace Technology and Astronautics.

Tabla de Contenidos:

Diffusion of moisture in adhesives
Diffusion of moisture in interfaces
Surface treatments for moisture resistance
Influence of moisture on the adhesive properties
Influence of water on the interface properties
Prediction of joint strength under humid conditions: Continuum mechanics approach
Prediction of joint strength under humid conditions: Fracture mechanics approach
Prediction of joint strength under humid conditions: Damage mechanics approach.

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