APA Citation

SpringerLink (Online service), Fan, X., & Suhir, E. (2010). Moisture Sensitivity of Plastic Packages of IC Devices (1st ed. 2010.). New York, NY: Springer US : Imprint: Springer.

Chicago Style Citation

SpringerLink (Online service), X.J Fan, and E. Suhir. Moisture Sensitivity of Plastic Packages of IC Devices. 1st ed. 2010. New York, NY: Springer US : Imprint: Springer, 2010.

MLA Citation

SpringerLink (Online service), X.J Fan, and E. Suhir. Moisture Sensitivity of Plastic Packages of IC Devices. 1st ed. 2010. New York, NY: Springer US : Imprint: Springer, 2010.

Warning: These citations may not always be 100% accurate.