Perkins, A. E., & Sitaraman, S. K. (2009). Solder Joint Reliability Prediction for Multiple Environments (1st ed. 2009.). New York, NY: Springer US : Imprint: Springer.
Chicago Style CitationPerkins, Andrew E., and Suresh K. Sitaraman. Solder Joint Reliability Prediction for Multiple Environments. 1st ed. 2009. New York, NY: Springer US : Imprint: Springer, 2009.
MLA CitationPerkins, Andrew E., and Suresh K. Sitaraman. Solder Joint Reliability Prediction for Multiple Environments. 1st ed. 2009. New York, NY: Springer US : Imprint: Springer, 2009.
Warning: These citations may not always be 100% accurate.