Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments

Detalles Bibliográficos
Autores principales: Perkins, Andrew E. (Autor), Sitaraman, Suresh K. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: eBook
Lenguaje:English
Publicado: New York, NY : Springer US : Imprint: Springer, 2009.
Edición:1st ed. 2009.
Materias:
Electronics.
Microelectronics.
Metals.
Optical materials.
Electronic materials.
Quality control.
Reliability.
Industrial safety.
Electronics and Microelectronics, Instrumentation.
Metallic Materials.
Optical and Electronic Materials.
Quality Control, Reliability, Safety and Risk.
Acceso en línea:https://doi.org/10.1007/978-0-387-79394-8

Internet

https://doi.org/10.1007/978-0-387-79394-8

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