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02088nam a22004095i 4500 |
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978-0-387-79394-8 |
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20191021202051.0 |
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cr nn 008mamaa |
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110402s2009 xxu| s |||| 0|eng d |
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|a 9780387793948
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7 |
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|a 10.1007/978-0-387-79394-8
|2 doi
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|a Sistema de Bibliotecas del Tecnológico de Costa Rica
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| 100 |
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|a Perkins, Andrew E.
|e author.
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|a Solder Joint Reliability Prediction for Multiple Environments
|c by Andrew E. Perkins, Suresh K. Sitaraman.
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| 250 |
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|a 1st ed. 2009.
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| 260 |
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|a New York, NY :
|b Springer US :
|b Imprint: Springer,
|c 2009.
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| 300 |
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|a XVI, 192 p. 70 illus.
|b online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a Background -- Literature Review -- Unified Finite Element Modeling for Prediction of Solder Joint Fatigue -- Validation of Unified FEM for Thermal Cycling and Power -- Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling -- Validation of Unified FEM and Development of Fatigue-life Equations for Vibration -- Universal Predictive Fatigue Life Equation and the Effect of Design Parameters -- Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages -- Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments -- Solder Joint Reliability Assessment for Desktop and Space Applications.
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|a Electronics.
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|a Microelectronics.
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|a Metals.
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|a Optical materials.
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|a Electronic materials.
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|a Quality control.
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|a Reliability.
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|a Industrial safety.
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|a Electronics and Microelectronics, Instrumentation.
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|a Metallic Materials.
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|a Optical and Electronic Materials.
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|a Quality Control, Reliability, Safety and Risk.
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|a Sitaraman, Suresh K.
|e author.
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| 710 |
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|a SpringerLink (Online service)
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|t Springer eBooks
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|u https://doi.org/10.1007/978-0-387-79394-8
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