Solder Joint Reliability Prediction for Multiple Environments
Autores principales: | Perkins, Andrew E. (Autor), Sitaraman, Suresh K. (Autor) |
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Autor Corporativo: | SpringerLink (Online service) |
Formato: | eBook |
Lenguaje: | English |
Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2009.
|
Edición: | 1st ed. 2009. |
Materias: | |
Acceso en línea: | https://doi.org/10.1007/978-0-387-79394-8 |
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