Solder Joint Reliability Prediction for Multiple Environments

Detalles Bibliográficos
Autores principales:	Perkins, Andrew E. (Autor), Sitaraman, Suresh K. (Autor)
Autor Corporativo:	SpringerLink (Online service)
Formato:	eBook
Lenguaje:	English
Publicado:	New York, NY : Springer US : Imprint: Springer, 2009.
Edición:	1st ed. 2009.
Materias:	Electronics. Microelectronics. Metals. Optical materials. Electronic materials. Quality control. Reliability. Industrial safety. Electronics and Microelectronics, Instrumentation. Metallic Materials. Optical and Electronic Materials. Quality Control, Reliability, Safety and Risk.
Acceso en línea:	https://doi.org/10.1007/978-0-387-79394-8

Tabla de Contenidos:

Background
Literature Review
Unified Finite Element Modeling for Prediction of Solder Joint Fatigue
Validation of Unified FEM for Thermal Cycling and Power
Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling
Validation of Unified FEM and Development of Fatigue-life Equations for Vibration
Universal Predictive Fatigue Life Equation and the Effect of Design Parameters
Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages
Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments
Solder Joint Reliability Assessment for Desktop and Space Applications.

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