Perkins, A. E., & Sitaraman, S. K. (2009). Solder Joint Reliability Prediction for Multiple Environments (1st ed. 2009.). New York, NY: Springer US : Imprint: Springer.
Citación estilo ChicagoPerkins, Andrew E., y Suresh K. Sitaraman. Solder Joint Reliability Prediction for Multiple Environments. 1st ed. 2009. New York, NY: Springer US : Imprint: Springer, 2009.
Cita MLAPerkins, Andrew E., y Suresh K. Sitaraman. Solder Joint Reliability Prediction for Multiple Environments. 1st ed. 2009. New York, NY: Springer US : Imprint: Springer, 2009.
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