Lau, J. H., Wong, C. P., Prince, J. L., & Nakayama, W. (1998). Electronic packaging: Design, materials, process, and reliability. New York: McGraw-Hill.
Chicago Style CitationLau, John H., C. P. Wong, John L. Prince, and Wataru Nakayama. Electronic Packaging: Design, Materials, Process, and Reliability. New York: McGraw-Hill, 1998.
MLA CitationLau, John H., C. P. Wong, John L. Prince, and Wataru Nakayama. Electronic Packaging: Design, Materials, Process, and Reliability. New York: McGraw-Hill, 1998.
Warning: These citations may not always be 100% accurate.