Electronic packaging : design, materials, process, and reliability /

Bibliographic Details
Other Authors: Lau, John H. (Autor/a), Wong, C. P. (Autor/a), Prince, John L. (Autor/a), Nakayama, Wataru (Autor/a)
Format: Book
Language:English
Published: New York : McGraw-Hill, c1998.
Series:Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
Subjects:

Sistema de Bibliotecas de Universidad de Costa Rica

Holdings details from Sistema de Bibliotecas de Universidad de Costa Rica
Call Number: 621.381.53
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