Electronic packaging : design, materials, process, and reliability /
Otros Autores: | Lau, John H. (Autor/a), Wong, C. P. (Autor/a), Prince, John L. (Autor/a), Nakayama, Wataru (Autor/a) |
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Formato: | Libro |
Lenguaje: | English |
Publicado: |
New York :
McGraw-Hill,
c1998.
|
Colección: | Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
|
Materias: |
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