Cita APA

Lau, J. H., Wong, C. P., Prince, J. L., & Nakayama, W. (1998). Electronic packaging: Design, materials, process, and reliability. New York: McGraw-Hill.

Citación estilo Chicago

Lau, John H., C. P. Wong, John L. Prince, y Wataru Nakayama. Electronic Packaging: Design, Materials, Process, and Reliability. New York: McGraw-Hill, 1998.

Cita MLA

Lau, John H., C. P. Wong, John L. Prince, y Wataru Nakayama. Electronic Packaging: Design, Materials, Process, and Reliability. New York: McGraw-Hill, 1998.