Design of Adhesive Joints Under Humid Conditions /

Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: da Silva, Lucas F. M. (Editor), Sato, Chiaki. (Editor)
Format: eBook
Language:English
Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Series:Advanced Structured Materials, 25
Subjects:
Table of Contents:
  • Diffusion of moisture in adhesives
  • Diffusion of moisture in interfaces
  • Surface treatments for moisture resistance
  • Influence of moisture on the adhesive properties
  • Influence of water on the interface properties
  • Prediction of joint strength under humid conditions: Continuum mechanics approach
  • Prediction of joint strength under humid conditions: Fracture mechanics approach
  • Prediction of joint strength under humid conditions: Damage mechanics approach.