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02858nam a22004095i 4500 |
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20210601124352.0 |
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cr nn 008mamaa |
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100301s2010 xxu| s |||| 0|eng d |
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|a 9781441900401
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| 024 |
7 |
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|a 10.1007/978-1-4419-0040-1
|2 doi
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| 040 |
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|a Sistema de Bibliotecas del Tecnológico de Costa Rica
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| 245 |
1 |
0 |
|a Nano-Bio- Electronic, Photonic and MEMS Packaging /
|c edited by C.P. Wong, Kyoung-Sik Moon, Yi (Grace) Li.
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| 250 |
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|a 1st ed. 2010.
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| 260 |
# |
# |
|a New York, NY :
|b Springer US :
|b Imprint: Springer,
|c 2010.
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| 300 |
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|a XI, 761 p. :
|b online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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0 |
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|a Nanomaterials for Microelectronic and Bio-packaging -- Nano-conductive Adhesives for Nano-electronics Interconnection -- Biomimetic Lotus Effect Surfaces for Nanopackaging -- Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials -- Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications -- 1D Nanowire Electrode Materials for Power Sources of Microelectronics -- Mechanical Energy Harvesting Using Wurtzite Nanowires -- Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging -- to Nanoparticle-Based Integrated Passives -- Thermally Conductive Nanocomposites -- Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension -- On-Chip Thermal Management and Hot-Spot Remediation -- Some Aspects of Microchannel Heat Transfer -- Nanoprobes for Live-Cell Gene Detection -- Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips -- Packaging of Biomolecular and Chemical Microsensors -- Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging -- Molecular Dynamics Applications in Packaging -- Nanoscale Deformation and Strain Analysis by AFM/DIC Technique -- Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.
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| 650 |
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0 |
|a Nanotechnology.
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| 650 |
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0 |
|a Electrochemistry.
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| 650 |
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0 |
|a Electronics.
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| 650 |
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0 |
|a Microelectronics.
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| 650 |
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0 |
|a Biomedical engineering.
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| 650 |
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0 |
|a Biophysics.
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| 650 |
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0 |
|a Biological physics.
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| 650 |
1 |
4 |
|a Nanotechnology.
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| 650 |
2 |
4 |
|a Electrochemistry.
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| 650 |
2 |
4 |
|a Electronics and Microelectronics, Instrumentation.
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| 650 |
2 |
4 |
|a Biomedical Engineering and Bioengineering.
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| 650 |
2 |
4 |
|a Biological and Medical Physics, Biophysics.
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| 700 |
1 |
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|a Wong, C.P.
|e editor.
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| 700 |
1 |
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|a Moon, Kyoung-Sik.
|e editor.
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| 700 |
1 |
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|a Li, Yi (Grace).
|e editor.
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| 710 |
2 |
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|a SpringerLink (Online service)
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| 773 |
0 |
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|t Springer eBooks
|