Nano-Bio- Electronic, Photonic and MEMS Packaging /
| Autor Corporativo: | |
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| Otros Autores: | , , |
| Formato: | eBook |
| Lenguaje: | English |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2010.
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| Edición: | 1st ed. 2010. |
| Materias: |
Tabla de Contenidos:
- Nanomaterials for Microelectronic and Bio-packaging
- Nano-conductive Adhesives for Nano-electronics Interconnection
- Biomimetic Lotus Effect Surfaces for Nanopackaging
- Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials
- Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications
- 1D Nanowire Electrode Materials for Power Sources of Microelectronics
- Mechanical Energy Harvesting Using Wurtzite Nanowires
- Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
- to Nanoparticle-Based Integrated Passives
- Thermally Conductive Nanocomposites
- Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
- On-Chip Thermal Management and Hot-Spot Remediation
- Some Aspects of Microchannel Heat Transfer
- Nanoprobes for Live-Cell Gene Detection
- Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips
- Packaging of Biomolecular and Chemical Microsensors
- Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging
- Molecular Dynamics Applications in Packaging
- Nanoscale Deformation and Strain Analysis by AFM/DIC Technique
- Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.