Nanopackaging Nanotechnologies and Electronics Packaging /
| Autor Corporativo: | |
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| Otros Autores: | |
| Formato: | eBook |
| Lenguaje: | English |
| Publicado: |
New York, NY :
Springer US : Imprint: Springer,
2008.
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| Edición: | 1st ed. 2008. |
| Materias: | |
| Acceso en línea: | https://doi.org/10.1007/978-0-387-47325-3 |
Tabla de Contenidos:
- Nanopackaging: Nanotechnologies and Electronics Packaging
- Modelling Technologies and Applications
- Application of Molecular Dynamics Simulation in Electronic Packaging
- Advances in Delamination Modeling
- Nanoparticle Properties
- Nanoparticle Fabrication
- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges
- Nanostructured Resistor Materials
- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging
- Nanoconductive Adhesives
- Nanoparticles in Microvias
- Materials and Technology for Conductive Microstructures
- A Study of Nanoparticles in SnAg-Based Lead-Free Solders
- Nano-Underfills for Fine-Pitch Electronics
- Carbon Nanotubes: Synthesis and Characterization
- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications
- Carbon Nanotubes for Thermal Management of Microsystems
- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes
- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes
- Nanowires in Electronics Packaging
- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging
- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities
- Nanoelectronics Landscape: Application, Technology, and Economy
- Errata.