Flip chip technologies /
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
c1996.
|
| Series: | Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
|
| Subjects: |
| Physical Description: | xxiv, 565 páginas : ilustraciones |
|---|---|
| ISBN: | 9780070366091 |