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00932nam a2200277uu 4500 |
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000104219 |
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20091023145659.0 |
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090921s1996 xxu ||||| eng |
020 |
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|a 9780070366091
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|a 9240801
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|a Sistema de Bibliotecas de la Universidad de Costa Rica
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|a eng
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082 |
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|a 621.381.046
|b F626f
|2 22
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1 |
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|a Lau, John H.
|e Editor/a
|4 edt
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1 |
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|a Flip chip technologies /
|c editor John H. Lau
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|a New York :
|b McGraw-Hill,
|c c1996.
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|a xxiv, 565 páginas :
|b ilustraciones
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490 |
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|a Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
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650 |
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|a CIRCUITOS INTEGRADOS
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650 |
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|x DISEÑO Y CONSTRUCCION
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|a ENCAPSULADO MICROELECTRONICO
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900 |
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|a 2009
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912 |
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|a 23-OCT-2009 - GARRIDO CORDERO, IRINA
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917 |
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|a 21-SEP-2009 - BUSTAMANTE MORA, CYNTHIA
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949 |
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|a IG -EMQ
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916 |
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|a Centro Catalográfico
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