Advanced packaging and manufacturing technology based on adhesion engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method.

Detalles Bibliográficos
Formato: Libro
Acceso en línea:Ver documento en línea
LEADER 00547nam a2200109 a 4500
001 000649017
005 20210812130046.0
008 210812 gr |||||| d
020 |a 9783319778723  |q (ebook) 
040 |a Sistema de Bibliotecas de la Universidad de Costa Rica 
245 1 0 |a Advanced packaging and manufacturing technology based on adhesion engineering :  |b Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. 
856 4 1 |u https://springerlink.proxyucr.elogim.com/book/10.1007/978-3-319-77872-3  |y Ver documento en línea