Polymeric materials for electronics packaging and interconnection /

Detalles Bibliográficos
Formato: Libro
Publicado: Washington, DC : American Chemical Society, 1989.
Colección:ACS symposium series ; 407
Materias:
Descripción
Notas:"Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988."
Descripción Física:xi, 499 p. : ill. ; 24 cm.
Bibliografía:Includes bibliographical references.
ISBN:0841216797