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| LEADER |
00874pam a20001814504500 |
| 001 |
262831 |
| 020 |
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|a 0841216797
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| 040 |
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|a Sistema de Bibliotecas USAC
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| 041 |
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|a eng.
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| 082 |
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|a 621.381
|b P783p
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| 099 |
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|a 621.381 P783p
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| 245 |
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|a Polymeric materials for electronics packaging and interconnection /
|c John H. Lupinski, editor, Robert S. Moore, editor. --
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| 260 |
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|a Washington, DC :
|b American Chemical Society,
|c 1989.
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| 300 |
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|a xi, 499 p. :
|b ill. ;
|c 24 cm.
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| 440 |
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|a ACS symposium series ;
|v 407
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| 500 |
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|a "Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988."
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| 504 |
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|a Includes bibliographical references.
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| 650 |
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|a Polimeros
|v Congresos, conferencias, etc.
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