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01519nam a22003735i 4500 |
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20211101160306.0 |
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130619s2009 xxu| s |||| 0|eng d |
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|a 9781441900760
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024 |
7 |
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|a 10.1007/978-1-4419-0076-0
|2 doi
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040 |
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|a Sistema de Bibliotecas del Tecnológico de Costa Rica
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100 |
1 |
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|a Gupta, Tapan.
|e author.
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245 |
1 |
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|a Copper Interconnect Technology /
|c by Tapan Gupta.
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250 |
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|a 1st ed. 2009.
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260 |
# |
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|a New York, NY :
|b Springer New York :
|b Imprint: Springer,
|c 2009.
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300 |
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|a XIX, 423 p. :
|b online resource.
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336 |
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|a text
|b txt
|2 rdacontent
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337 |
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|a computer
|b c
|2 rdamedia
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338 |
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|a online resource
|b cr
|2 rdacarrier
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|a Dielectric Materials -- Diffusion and Barrier Layers -- Pattern Generation -- Deposition Technologies of Materials for Cu-Interconnects -- The Copper Damascene Process and Chemical Mechanical Polishing -- Conduction and Electromigration -- Routing and Reliability.
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650 |
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|a Electronics.
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|a Microelectronics.
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650 |
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|a Optical materials.
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650 |
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|a Electronic materials.
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650 |
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|a Electronic circuits.
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650 |
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|a Nanotechnology.
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650 |
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4 |
|a Electronics and Microelectronics, Instrumentation.
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650 |
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4 |
|a Optical and Electronic Materials.
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4 |
|a Circuits and Systems.
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650 |
2 |
4 |
|a Nanotechnology.
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|a SpringerLink (Online service)
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773 |
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|t Springer eBooks
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900 |
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|a Libro descargado a ALEPH en bloque (proveniente de proveedor)
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