Copper Interconnect Technology /

Copper Interconnect Technology /

Detalles Bibliográficos
Autor principal: Gupta, Tapan. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: eBook
Lenguaje:English
Publicado: New York, NY : Springer New York : Imprint: Springer, 2009.
Edición:1st ed. 2009.
Materias:
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Electronic circuits.
Nanotechnology.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Circuits and Systems.
Tabla de Contenidos:
  • Dielectric Materials
  • Diffusion and Barrier Layers
  • Pattern Generation
  • Deposition Technologies of Materials for Cu-Interconnects
  • The Copper Damascene Process and Chemical Mechanical Polishing
  • Conduction and Electromigration
  • Routing and Reliability.

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