Copper Interconnect Technology /
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| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY :
Springer New York : Imprint: Springer,
2009.
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| Edition: | 1st ed. 2009. |
| Subjects: |
Table of Contents:
- Dielectric Materials
- Diffusion and Barrier Layers
- Pattern Generation
- Deposition Technologies of Materials for Cu-Interconnects
- The Copper Damascene Process and Chemical Mechanical Polishing
- Conduction and Electromigration
- Routing and Reliability.