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100301s2010 gw | s |||| 0|eng d |
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|a 9783642031601
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|a 10.1007/978-3-642-03160-1
|2 doi
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|a Sistema de Bibliotecas del Tecnológico de Costa Rica
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|a Shimizu, Kenichi.
|e author.
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|a New Horizons of Applied Scanning Electron Microscopy /
|c by Kenichi Shimizu, Tomoaki Mitani.
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|a 1st ed. 2010.
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|a Berlin, Heidelberg :
|b Springer Berlin Heidelberg :
|b Imprint: Springer,
|c 2010.
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|a XIV, 182 p. 102 illus., 25 illus. in color. :
|b online resource.
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a Springer Series in Surface Sciences,
|v 45
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|a Application Example 1: Lateral Resolution of in-Lens SE and High-Angle BSE Imaging at Low Accelerating Voltages, Below 2.0 kV -- Application Example 2: Z-Contrast Sensitivity in Low-Voltage, High-Angle BSE Imaging -- Application Example 3: Information Depth in Low-Voltage, High-Angle BSE Imaging -- Application Example 4: Nano Inclusions in Co-Hardened Gold Plating for Electronic Applications #x2013; Further Evidence for High Lateral Resolution in Low-Voltage, High-Angle BSE Imaging -- Application Example 5: A Thin Layer of Organic Contaminant on the Surface of Mirror-Polished Al-Based Hard Disks -- Application Example 6: A Further Potential of Ultralow-Voltage In-lens SE Imaging -- Application Example 7: Sample Surface Preparation by Ultramicrotomy Using a Diamond Knife for Cross-Sectional Examination of Various Coatings on Metals -- Application Example 8: Cross-Sectional Examination of a Galvanized Steel -- Application Example 9: Cross-Sectional Examination of a Painted Steel -- Application Example 10: Cross-Sectional Examination of Solder Joint of the Printed Circuit Board -- Application Example 11: Cross-Sectional Examination of a Tin-Plated Copper Sheet for Electronic Application -- Application Example 12: Cross-Sectional Examination of an Anodized Aluminum Alloy for Aerospace Application -- Application Example 13: Cross-Sectional Examination of a Porous Anodic Oxide Film Grown on a Heterogeneous Al-Fe Alloy -- Application Example 14: Corrosion of an Al 2024-T3 Alloy for Aerospace Application -- Application Example 15: Cross-Sectional Examination of an Etched Al Foil for Capacitor Application -- Application Example 16: On the Nature of rf-GD Sputtering -- Application Example 17: On the Surface Damages Associated with rf-GD Sputtering -- Application Example 18: Precipitates in a Stainless Steel -- Application Example 19: Ferrite Precipitates in a Low-Carbon Stainless Steel -- Application Example 20: A Novel Use of rf-GD Sputtered Surfaces for Oxidation Study of Iron, Nickel, and Copper -- Application Example 21: Preparation of #x201C;Highly Flat and Damage-Free#x201D; Surfaces for High-Resolution Channeling BSE Imaging -- Application Example 22: Oxidation of Sputtered Metal Surface in Air #x2013; The Main Cause of Surface Alternation -- Application Example 23: Microstructure of a Ti Alloy -- Application Example 24: Microstructure of a Ni-Based Super Alloy for Aerospace Applications -- Application Example 25: Cracks in a Nitrogen-Doped Stainless Steel -- Application Example 26: Sample Surface Preparation Using rf-GD Sputtering for Cross-Sectional Examination -- Application Example 27: Cross-Sectional Examination of a Galvanized Steel for Car Bodies -- Application Example 28: Cross-Sectional Examination of a Flash Memory Device -- Application Example 29: Cross-Sectional Examination of a Multilayered Glass -- Application Example 30: Cross-Sectional Examination of a Copper Sheet for Electronic Application -- Application Example 31: Cross-Sectional Examination of a Nitrided Carbon Steel -- Application Example 32: Cross-Sectional Examination of Deformed Surface Regions of Carbon Steel after Shot Peening -- Application Example 33: Cross-Sectional Examination of a Thermal-Sprayed WC-18% Co Coating on a Titanium Alloy -- Application Example 34: Cross-Sectional Examination of a Thermal Barrier Coating on the Ni-based Super Alloy for Aerospace Applications -- Application Example 35: Is EDX Elemental Mapping Really Necessary? -- Application Example 36: Titanium Carbide Precipitates in a Duplex Stainless Steel -- Application Example 37: Adhesion Between the Hard Chromium Coating and Copper Substrate -- Application Example 38: On the Possibility of the Use of rf-GD Sputtering for Follow-Up Treatment of Thin Slices for TEM Examination -- Application Example 39: On 3D Imaging of Semiconductor Devices by FE-SEM -- Concluding Remarks.
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|a Materials—Surfaces.
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|a Thin films.
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|a Physical measurements.
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|a Measurement .
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|a Solid state physics.
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|a Spectroscopy.
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|a Microscopy.
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|a Nanotechnology.
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|a Surfaces and Interfaces, Thin Films.
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|a Measurement Science and Instrumentation.
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|a Solid State Physics.
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|a Spectroscopy and Microscopy.
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|a Nanotechnology.
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|a Nanotechnology and Microengineering.
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|a Mitani, Tomoaki.
|e author.
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|a SpringerLink (Online service)
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773 |
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|t Springer eBooks
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