New Horizons of Applied Scanning Electron Microscopy /
| Autores principales: | , |
|---|---|
| Autor Corporativo: | |
| Formato: | eBook |
| Lenguaje: | English |
| Publicado: |
Berlin, Heidelberg :
Springer Berlin Heidelberg : Imprint: Springer,
2010.
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| Edición: | 1st ed. 2010. |
| Colección: | Springer Series in Surface Sciences,
45 |
| Materias: |
Tabla de Contenidos:
- Application Example 1: Lateral Resolution of in-Lens SE and High-Angle BSE Imaging at Low Accelerating Voltages, Below 2.0 kV
- Application Example 2: Z-Contrast Sensitivity in Low-Voltage, High-Angle BSE Imaging
- Application Example 3: Information Depth in Low-Voltage, High-Angle BSE Imaging
- Application Example 4: Nano Inclusions in Co-Hardened Gold Plating for Electronic Applications #x2013; Further Evidence for High Lateral Resolution in Low-Voltage, High-Angle BSE Imaging
- Application Example 5: A Thin Layer of Organic Contaminant on the Surface of Mirror-Polished Al-Based Hard Disks
- Application Example 6: A Further Potential of Ultralow-Voltage In-lens SE Imaging
- Application Example 7: Sample Surface Preparation by Ultramicrotomy Using a Diamond Knife for Cross-Sectional Examination of Various Coatings on Metals
- Application Example 8: Cross-Sectional Examination of a Galvanized Steel
- Application Example 9: Cross-Sectional Examination of a Painted Steel
- Application Example 10: Cross-Sectional Examination of Solder Joint of the Printed Circuit Board
- Application Example 11: Cross-Sectional Examination of a Tin-Plated Copper Sheet for Electronic Application
- Application Example 12: Cross-Sectional Examination of an Anodized Aluminum Alloy for Aerospace Application
- Application Example 13: Cross-Sectional Examination of a Porous Anodic Oxide Film Grown on a Heterogeneous Al-Fe Alloy
- Application Example 14: Corrosion of an Al 2024-T3 Alloy for Aerospace Application
- Application Example 15: Cross-Sectional Examination of an Etched Al Foil for Capacitor Application
- Application Example 16: On the Nature of rf-GD Sputtering
- Application Example 17: On the Surface Damages Associated with rf-GD Sputtering
- Application Example 18: Precipitates in a Stainless Steel
- Application Example 19: Ferrite Precipitates in a Low-Carbon Stainless Steel
- Application Example 20: A Novel Use of rf-GD Sputtered Surfaces for Oxidation Study of Iron, Nickel, and Copper
- Application Example 21: Preparation of #x201C;Highly Flat and Damage-Free#x201D; Surfaces for High-Resolution Channeling BSE Imaging
- Application Example 22: Oxidation of Sputtered Metal Surface in Air #x2013; The Main Cause of Surface Alternation
- Application Example 23: Microstructure of a Ti Alloy
- Application Example 24: Microstructure of a Ni-Based Super Alloy for Aerospace Applications
- Application Example 25: Cracks in a Nitrogen-Doped Stainless Steel
- Application Example 26: Sample Surface Preparation Using rf-GD Sputtering for Cross-Sectional Examination
- Application Example 27: Cross-Sectional Examination of a Galvanized Steel for Car Bodies
- Application Example 28: Cross-Sectional Examination of a Flash Memory Device
- Application Example 29: Cross-Sectional Examination of a Multilayered Glass
- Application Example 30: Cross-Sectional Examination of a Copper Sheet for Electronic Application
- Application Example 31: Cross-Sectional Examination of a Nitrided Carbon Steel
- Application Example 32: Cross-Sectional Examination of Deformed Surface Regions of Carbon Steel after Shot Peening
- Application Example 33: Cross-Sectional Examination of a Thermal-Sprayed WC-18% Co Coating on a Titanium Alloy
- Application Example 34: Cross-Sectional Examination of a Thermal Barrier Coating on the Ni-based Super Alloy for Aerospace Applications
- Application Example 35: Is EDX Elemental Mapping Really Necessary?
- Application Example 36: Titanium Carbide Precipitates in a Duplex Stainless Steel
- Application Example 37: Adhesion Between the Hard Chromium Coating and Copper Substrate
- Application Example 38: On the Possibility of the Use of rf-GD Sputtering for Follow-Up Treatment of Thin Slices for TEM Examination
- Application Example 39: On 3D Imaging of Semiconductor Devices by FE-SEM
- Concluding Remarks.