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| LEADER |
01972nam a22004215i 4500 |
| 001 |
000291774 |
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20210608132019.0 |
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cr nn 008mamaa |
| 008 |
100301s2010 xxu| s |||| 0|eng d |
| 020 |
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|a 9781441907844
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| 024 |
7 |
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|a 10.1007/978-1-4419-0784-4
|2 doi
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| 040 |
|
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|a Sistema de Bibliotecas del Tecnológico de Costa Rica
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| 245 |
1 |
0 |
|a Three-Dimensional Integrated Circuit Design :
|b EDA, Design and Microarchitectures /
|c edited by Yuan Xie, Jingsheng Jason Cong, Sachin Sapatnekar.
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| 250 |
|
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|a 1st ed. 2010.
|
| 260 |
# |
# |
|a New York, NY :
|b Springer US :
|b Imprint: Springer,
|c 2010.
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| 300 |
|
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|a XII, 284 p. :
|b online resource.
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| 336 |
|
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a Integrated Circuits and Systems,
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| 505 |
0 |
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|a 3D Process Technology Considerations -- Thermal and Power Delivery Challenges in 3D ICs -- Thermal-Aware 3D Floorplan -- Thermal-Aware 3D Placement -- Thermal Via Insertion and Thermally Aware Routing in 3D ICs -- Three-Dimensional Microprocessor Design -- Three-Dimensional Network-on-Chip Architecture -- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers -- System-Level 3D IC Cost Analysis and Design Exploration.
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| 650 |
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0 |
|a Electronics.
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| 650 |
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0 |
|a Microelectronics.
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| 650 |
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0 |
|a Optical materials.
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| 650 |
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0 |
|a Electronic materials.
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| 650 |
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0 |
|a Materials—Surfaces.
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| 650 |
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0 |
|a Thin films.
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| 650 |
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0 |
|a Engineering.
|
| 650 |
1 |
4 |
|a Electronics and Microelectronics, Instrumentation.
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| 650 |
2 |
4 |
|a Optical and Electronic Materials.
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| 650 |
2 |
4 |
|a Surfaces and Interfaces, Thin Films.
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| 650 |
2 |
4 |
|a Engineering, general.
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| 700 |
1 |
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|a Xie, Yuan.
|e editor.
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| 700 |
1 |
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|a Cong, Jingsheng Jason.
|e editor.
|
| 700 |
1 |
|
|a Sapatnekar, Sachin.
|e editor.
|
| 710 |
2 |
|
|a SpringerLink (Online service)
|
| 773 |
0 |
|
|t Springer eBooks
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| 900 |
|
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|a Libro descargado a ALEPH en bloque (proveniente de proveedor)
|