Three-Dimensional Integrated Circuit Design : EDA, Design and Microarchitectures /

Three-Dimensional Integrated Circuit Design : EDA, Design and Microarchitectures /

Detalles Bibliográficos
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Xie, Yuan. (Editor ), Cong, Jingsheng Jason. (Editor ), Sapatnekar, Sachin. (Editor )
Formato: eBook
Lenguaje:English
Publicado: New York, NY : Springer US : Imprint: Springer, 2010.
Edición:1st ed. 2010.
Colección:Integrated Circuits and Systems,
Materias:
Electronics.
Microelectronics.
Optical materials.
Electronic materials.
Materials—Surfaces.
Thin films.
Engineering.
Electronics and Microelectronics, Instrumentation.
Optical and Electronic Materials.
Surfaces and Interfaces, Thin Films.
Engineering, general.
Tabla de Contenidos:
  • 3D Process Technology Considerations
  • Thermal and Power Delivery Challenges in 3D ICs
  • Thermal-Aware 3D Floorplan
  • Thermal-Aware 3D Placement
  • Thermal Via Insertion and Thermally Aware Routing in 3D ICs
  • Three-Dimensional Microprocessor Design
  • Three-Dimensional Network-on-Chip Architecture
  • PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers
  • System-Level 3D IC Cost Analysis and Design Exploration.

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