Three-Dimensional Integrated Circuit Design : EDA, Design and Microarchitectures /
| Corporate Author: | |
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| Other Authors: | , , |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY :
Springer US : Imprint: Springer,
2010.
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| Edition: | 1st ed. 2010. |
| Series: | Integrated Circuits and Systems,
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| Subjects: |
Table of Contents:
- 3D Process Technology Considerations
- Thermal and Power Delivery Challenges in 3D ICs
- Thermal-Aware 3D Floorplan
- Thermal-Aware 3D Placement
- Thermal Via Insertion and Thermally Aware Routing in 3D ICs
- Three-Dimensional Microprocessor Design
- Three-Dimensional Network-on-Chip Architecture
- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers
- System-Level 3D IC Cost Analysis and Design Exploration.