Flip chip technologies /

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Flip chip technologies /

Bibliographic Details
Main Author:	Lau, John H. (Editor)
Format:	Book
Language:	English
Published:	New York : McGraw-Hill, c1996.
Series:	Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
Subjects:	CIRCUITOS INTEGRADOS DISEÑO Y CONSTRUCCION ENCAPSULADO MICROELECTRONICO

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