Skip to content
VuFind
Language
English
Español
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
Search
Materials for electronic packa...
Description
Cite this
Email this
Print
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
Export to MARC
Export to RDF
Export to BibTeX
Export to RIS
Materials for electronic packaging /
Bibliographic Details
Main Author:
Chung, Deborah D. L.
(Editor)
Format:
Book
Language:
English
Published:
Boston :
Butterworth Heinemann,
c1995.
Subjects:
ELECTRONICA
ENCAPSULADO ELECTRONICO
CERAMICA
>
MATERIALES
Holdings
Description
Similar Items
Staff View
Description
Physical Description:
xiv, 368 páginas : ilustraciones
ISBN:
9780750693141
Similar Items
Failure modes and mechanisms in electronic packages /
by: Viswanadham, Puligandla, et al.
Published: (1998)
Electronic packaging : design, materials, process, and reliability /
Published: (1998)
The basics of soldering /
by: Rahn, Armin, et al.
Published: (1993)
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
by: Lau, John H., et al.
Published: (1997)
Wire bonding in microelectronics : materials, processes, reliability, and yield /
by: Harman, George G., et al.
Published: (1997)
×
Loading...