Modern solder technology for competitive electronics manufacturing /

Bibliographic Details
Main Author: Hwang, Jennie S. (Author, Autor/a)
Format: Book
Language:English
Published: New York : McGraw-Hill, c1996.
Series:Electronic Packaging and Interconnection Series / Charles M. Harper, series advisor
Subjects:

Sistema de Bibliotecas de Universidad de Costa Rica

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Call Number: 621.381.046
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