3D microelectronic packaging : from fundamentals to applications /

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3D microelectronic packaging : from fundamentals to applications /

Bibliographic Details
Main Author:	Chen, Liangbiao (Autor/a)
Other Authors:	Conway, Paul 1953- (Autor/a), Dutta, Indranath (Autor/a), Xuejun, Fan (Autor/a), Ganguly Amlan (Autor/a), Yan, Li (Editor/a), Goyal, Deepak (Editor/a)
Format:	Book
Language:	English
Published:	Switzerland : Springer, c2017.
Series:	Springer series in advanced microelectronics / series editors: Kukjin Chun, Kiyoo Itoh, Thomas H. Lee, Rino Micheloni, Takayasu Sakurai [y otras dos] Volume 57
Subjects:	ELECTRONICA MICROELECTRONICA CIRCUITOS ELECTRONICOS BIOTECNOLOGIA
Online Access:	Ver documento en línea

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