Advanced thermal management materials /
| Main Author: | Jiang, Guosheng (Autor/a) |
|---|---|
| Other Authors: | Diao, Liyong (Autor/a), Kuang, Ken (Autor/a) |
| Format: | Book |
| Language: | English |
| Published: |
New York :
Springer,
[2013].
|
| Subjects: | |
| Online Access: | Ver documento en línea |
Similar Items
-
Advanced thermal stress analysis of smart materials and structures /
by: Chen, Zengtao
Published: (2020) -
Multichip modules : systems advantages, major constructions and materials technologies /
by: Johnson, R. Wayne 1957-
Published: (1991) -
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies /
by: Lau, John H., et al.
Published: (1997) -
Advanced materials for thermal management of electronic packaging /
by: Tong, Xingcun Colin
Published: (2011) -
Symposium on thermal conductivity measurements and applications of thermal insulations
Published: (1957)