RF and Microwave Microelectronics Packaging /

RF and Microwave Microelectronics Packaging /

Detalles Bibliográficos
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Kuang, Ken. (Editor ), Kim, Franklin. (Editor ), Cahill, Sean S. (Editor )
Formato: eBook
Lenguaje:English
Publicado: New York, NY : Springer US : Imprint: Springer, 2010.
Edición:1st ed. 2010.
Materias:
Electronics.
Microelectronics.
Microwaves.
Optical engineering.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microwaves, RF and Optical Engineering.
Circuits and Systems.

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