RF and Microwave Microelectronics Packaging /

Detalles Bibliográficos
Autor Corporativo:	SpringerLink (Online service)
Otros Autores:	Kuang, Ken. (Editor ), Kim, Franklin. (Editor ), Cahill, Sean S. (Editor )
Formato:	eBook
Lenguaje:	English
Publicado:	New York, NY : Springer US : Imprint: Springer, 2010.
Edición:	1st ed. 2010.
Materias:	Electronics. Microelectronics. Microwaves. Optical engineering. Electronic circuits. Electronics and Microelectronics, Instrumentation. Microwaves, RF and Optical Engineering. Circuits and Systems.

Tabla de Contenidos:

Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
Polymeric Microelectromechanical Millimeter Wave Systems
Millimeter-Wave Chip-on-Board Integration and Packaging
Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
RF/Microwave Substrate Packaging Roadmap for Portable Devices
Ceramic Systems in Package for RF and Microwave
Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
LTCC Substrates for RF/MW Application
High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
High Performance Microelectronics Packaging Heat Sink Materials
Technology Research on AlN 3D MCM.

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