RF and Microwave Microelectronics Packaging /
| Corporate Author: | |
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| Other Authors: | , , |
| Format: | eBook |
| Language: | English |
| Published: |
New York, NY :
Springer US : Imprint: Springer,
2010.
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| Edition: | 1st ed. 2010. |
| Subjects: |
Table of Contents:
- Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
- Polymeric Microelectromechanical Millimeter Wave Systems
- Millimeter-Wave Chip-on-Board Integration and Packaging
- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
- RF/Microwave Substrate Packaging Roadmap for Portable Devices
- Ceramic Systems in Package for RF and Microwave
- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
- LTCC Substrates for RF/MW Application
- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
- High Performance Microelectronics Packaging Heat Sink Materials
- Technology Research on AlN 3D MCM.